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产品介绍：
1）广角轮廓相机，进行轮廓识别，自动校正硅片角度；
2）高精度CCD相机，进行全自动水平修正及位置修正；
3）压力可控，实时显示压力数值；
4）自动覆膜、喷液、放片；
5）带连片检测功能，无连片；
6）可兼容4英寸、5英寸的晶圆片；
7）全自动上下料功能，无人值守式全自动运行（料盒方式，整盒上下料），产品批量化生产。","Detail":"
晶圆全自动裂片机<\/strong><\/span><\/p>
<\/span><\/p>产品介绍：<\/span><\/p>1）广角轮廓相机，进行轮廓识别，自动校正硅片角度；<\/span><\/p>2）高精度CCD相机，进行全自动水平修正及位置修正；<\/span><\/p>3）压力可控，实时显示压力数值；<\/span><\/p>4）自动覆膜、喷液、放片；<\/span><\/p>5）带连片检测功能，无连片；<\/span><\/p>6）可兼容4英寸、5英寸的晶圆片；<\/span><\/p>7）全自动上下料功能，无人值守式全自动运行（料盒方式，整盒上下料），产品批量化生产。<\/span><\/p>
<\/span><\/p>技术参数：<\/span><\/p>设备型号 MSW-WSU-A<\/span><\/p>控制方式 PLC+触摸屏+电脑主机<\/span><\/p>对位方式 相机识别自动对位<\/span><\/p>传送方式 伺服电机<\/span><\/p>裂片力度 压力传感器（压力大小可调）<\/span><\/p>喷液喷头 雾状喷头<\/span><\/p>故障处理 各个故障都带报警提示功能<\/span><\/p>端口 预留MES端口<\/span><\/p>加工定位方式 自动上下料&自动对位<\/span><\/p>效率（裂片） ＞120片/h<\/span><\/p>
<\/span><\/p>应用范围：<\/span><\/p>适用于半导体产业中的GPP晶圆的裂片。<\/span><\/p>
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